IPC/JEDEC J-STDC. Handling, Packing,. Shipping and Use of. Moisture/ Reflow. Sensitive Surface. Mount Devices. A joint standard. IPC/JEDEC J-STDC-1 -. August IPC/JEDEC J-STDC -. February IPC/JEDEC J-STDB.1 includes Amendment 1 -. complies with ipc/JEDEc J-stDA. 3M™ HIC this card meets the IPC /JEDEC J-STD-. A standard. card size: 2” x 3” inches indicates: 5,10,15%.

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For ease of use, the halogen moisture analyzer was considered the best. BoxEvansville, IN; Fax: The vapor pressure of moisture and other gases trapped inside the walls of a plastic connector increase rapidly when the connector is exposed to the high temperatures of solder reflow.

Figures 1 and 2. If the document is revised or amended, you will be notified by email. Please first log in with a verified email before subscribing to alerts. Higher temperatures required for lead-free SMT soldering will force a change from many currently used connector housing resins, which will melt, suffer pin retention failures or fail to meet dimensional stability requirements.

These methods sstd avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. The company has analyzed the types of bags that are available for connector packaging and come up with some recommendations based upon WVTR ratings Table 2. This standard is not included in any packages.

DescoEurope – Humidity Indicator Card, 5% 10% 15% RH, J-STDA, /Can

The next phase will be lead-free solder compliance for board assembly. By using these procedures, safe and damage-free reflow can be achieved with the dry packing process, providing a minimum shelf life of 12 months from the seal date when using sealed dry bags.


Already Subscribed to this document. You can download and open this file to your own computer but DRM prevents opening this file on another computer, including a nedec server. Effectiveness of desiccant on moisture absorption of packaged connectors.

Minimizing Effects of Lead-free SMT Assembly on Connector Housing Resins

Subscription pricing is determined by: Many Asian OEMs, who have been converting to the lead-free solder process for the last few years, require that their connectors be packaged to minimize moisture absorption for wtd reason. The company compared three moisture measurement techniques: The key parameter in blistering of connector 0333a is the control of moisture absorption in the molded jedev. But the problems listed previously for connectors in these hot oven environments can also result in board rework.

In this stage, the higher liquidus temperatures required for lead-free solders may have a profound effect on the connector insulator housings.

Blister onset temperature is dependent upon several factors, including wall thickness, percentage of moisture in the part, speed of connector heating, and peak temperature of the reflow process. Approved options include clay and silica gel. All techniques provided similar moisture percentages in parts.

CARD, HUMIDITY INDICATOR, 5% 10% 15% RH, J-STDA | Arbell Electronics Distributor

Lead-free solders result in higher peak temperatures, meaning more blistering. Some materials currently used may deform melt or show signs of delamination on the side walls, referred to as “blistering. This standard is also available to be included in Standards Subscriptions. Your Alert Profile lists the documents that will be monitored. The higher preheat temperatures typical in lead-free solder profiles may provide more safety from blistering for thinner-walled parts than current tin-lead solder profiles due to the direct relationship between moisture desorption rate and temperature.


Many connector suppliers are eliminating, or have already eliminated, lead from jddec contact plating process.

Please first verify your email before subscribing to alerts. You may delete a document from your Alert Profile at any time. They were subjected to two different storage conditions: Key to elimination of blistering is moisture control for most of the temperature-capable engineering resins used in connector housings.

If all etd absorption precautions are taken and connectors are still exhibiting some delamination during SMT assembly, measuring the amount of moisture in the parts to determine the steps required to solder without connector blistering may be required.

This delamination is commonly referred to as a “blister. MBBs in two different thicknesses 0. Proceed to Checkout Continue Shopping.

For standard MBB sizes used for shipping connectors loose or on reels the amount of desiccant required is less than two units.