LMT/NOPB Texas Instruments Audio Amplifiers Overture Audio Pwr Amp Series Dual 40W datasheet, inventory, & pricing. LMT Texas Instruments Audio Amplifiers datasheet, inventory, & pricing. LMT LM – Overture Audio Power Amplifier Series Dual Watt Audio Power Amplifier With Mute, Package: to , Pin Nb=15 LM OvertureTM.
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Special Audio Amplifier Application Circuit. The clamping effect is quite the same, however, the output transistors are designed to work alter- nately by sinking large current spikes.
Please refer to AN for more detailed information.
The waveform to the right of the SOA graph exemplifies how the dynamic pro- tection will cause waveform distortion when enabled. The clamping effect is quite the same. The LM has excellent power supply rejection and does. This greatly reduces the stress imposed on the IC by. Power dissipation within the integrated circuit package is a. Equation 1 exemplifies the theoretical maximum power dis. Since convection heat flow power dissipation is analogous to current flow, thermal resistance is analogous to electrical resistance, and tem- perature drops are analogous to voltage drops, the power dissipation out of the LM is equal to the following: SPiKe Protection Circuitry is not enabled.
Single Supply Amplifier Application Circuit. Typical Audio Amplifier Application Circuit. LM should have its supply leads bypassed with.
The choice of a heat sink for a high-power audio amplifier is. Taking into account supply line fluc. Upon system power-up, the under-voltage protection cir. SPiKe Protection means that these.
LMT Datasheet(PDF) – National Semiconductor (TI)
However, to improve system. Auxiliary Amplifier Application Circuit. Equation 1 exemplifies the theoretical maximum power dis- sipation point of each amplifier where V CC is the total supply voltage.
It starts operating again when the die temperature. Thus by knowing the total supply voltage and rated output load, the maximum power dissipation point can be calcu- lated.
Once the maximum package power dissipation has been. However, to improve system performance as well as eliminate possible oscillations, the LM should have its supply leads bypassed with low-inductance capacitors having short leads that are lo- cated datasheft to the package terminals.
Using the best heat sink possible within the cost and space constraints of the system will improve the long-term reliability of any power semiconductor device, as discussed in the Determining the Correct Heat Sink Section.
datsheet Upon turn-off, the output of the LM is brought to ground be- fore the power supplies such that no transients occur at power-down. Taking into account supply line fluc- tuations, it is a good idea to pull out 1 mA per mute pin or 2 mA total if both pins are tied together.
The package dissipation is twice the number which re- sults from Equation 1 since there are two amplifiers in each LM This calculation is made using Equation 3. This greatly reduces the stress imposed on the IC by thermal cycling, which in turn improves its reliability under sustained fault conditions.
The thermal resistance from the die junction to the outside.
Using the best heat sink possible within the cost and. Special Audio Amplifier Application Circuit 5 www. Each amplifier within the LM has an independent. Since the die temperature is directly dependent upon the. The package dissipation is twice the number which re.